Electronics Assembly Quality Engineer

Pay: $60 - $100/hour

Required Skills
X-ray inspection of area-array solder joints
Reflow process
Solder defect root cause
Counterfeit electronic component screening
About micro1
micro1 is a data lab that helps AI labs & Enterprises train foundational models and agents. We provide frontier evaluations and reinforcement learning environments to improve LLM capabilities, as well as contextual evaluations to monitor and improve AI agents in enterprise settings.

Our AI recruiting agent sources and vets domain experts for our data platform that enables rapid production of high-quality training data. Our research spans high-value, specialized domains (legal, medical, finance, coding, etc.), where expert-level data is the hardest to produce and most valuable for advanced model performance. Our pipeline performance system ensures both quality and velocity.

Role Title: Electronics Assembly Quality Engineer

Role Type: Contractor

Location: Remote

micro1 is engaging Electronics Assembly Quality Engineers to contribute their expertise on a customer project focused on electronics manufacturing quality and reliability. In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters. This opportunity is suited to process and quality engineering professionals with hands-on experience in reviewing X-ray images of area-array solder joints (BGA, CGA, LGA), analyzing solder defects, optimizing reflow processes, and laboratory specialists skilled in counterfeit electronic component screening. Cases span voiding, head-in-pillow, bridging, open joints, reflow profile adjustments, Class 3 acceptance, and component authenticity detection. Contributors may have strengths on either process quality or counterfeit analysis—please indicate your focus.

Scope of Work

Analyze and interpret X-ray images of BGA, CGA, and LGA solder joints, identifying defects such as voiding, head-in-pillow, bridging, and opens.
Review and suggest improvements to reflow soldering profiles to address process-related solder defects.
Provide detailed root cause analysis and recommendations for solder joint anomalies and reliability concerns.
Assess real-world cases for IPC Class 3 acceptance, documenting critical observations and decision criteria.
Evaluate and outline test laboratory flows for counterfeit electronic component detection and screening.
Deliver comprehensive written and verbal summaries of findings, ensuring clarity and actionable guidance.
Contribute technical insights that enhance AI training data quality in the field of electronics assembly and component validation.

Preferred Qualifications

Extensive hands-on experience in electronics manufacturing process or quality engineering, particularly with area-array packages.
Advanced proficiency in interpreting X-ray images and diagnosing solder joint failures.
Strong expertise in reflow soldering process optimization and process troubleshooting.
Familiarity with IPC acceptance standards, especially Class 3 requirements for critical applications.
Experience with counterfeit component detection test methodologies and laboratory practices in component authentication.
Exceptional written and verbal communication skills for technical documentation and cross-functional knowledge sharing.
Background as either a process engineer, quality engineer, or laboratory analyst in electronics assembly or component screening (specify your strength area).
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